DC Measure Hall Effect Current Transformer
Product Description
FUNCTION :
MEASURE THE ARBIRARY WAVEFORM CURRENT ,SUCH AS DC AC ,TRANSIENT PEAK ,PAMMETERS MEASUREMENT .BETTER LINEARITY ,
GOOD DYNAMIC PERFPRMANCE WORKING HANDWIDE ,STRONG OVERLOAD ABILITY ,
Application :
Used in electric power, industrial automation, machinery, automotive, home appliances and other industries and fields
Brief introduction of principle :
The magnetic field generated by the primary current Ip flowing through the conductor is concentrated in the magnetic ring. The magnitude of this magnetic field is proportional to the current flowing through the conductor. The Hall element in the magnetic ring air gap measures and amplifies the output, and the output voltage Vs is reflecting the primary current Ipo accurately.
Characteristic :
Highly insulated between the primary and secondary side
Small size ,light weight
No insertion loss ,low power consumption
Wide detection range
Technical Parameter
Specification | 20A/4V | 50A/4V | 100A/4V | Unit | |
---|---|---|---|---|---|
IPN | Primary Rated Input Current | 20 | 50 | 100 | A |
IP | Primary Current Measurement Range | 0~40 | 0~75 | 0~150 | A |
VSN | Secondary rated output voltage | 4 | V | ||
VC | The Power Supply Voltage | ±12~15(±5%) | V | ||
IC | Current Consumption | <10+Is | mA | ||
Vd | Insulation Voltage | Between primary and secondary circuits:2.5kV/50Hz/1min | |||
εL | Linearity | <0.2 | %FS | ||
X | Precision | TA=25℃:≤±0.2 | % | ||
V0 | Offset Voltage | TA=25℃:≤±0.1 | mV | ||
VOM | Magnetic Offset Voltage | IP=0 after 3*IPN:≤±0.15 | mV | ||
VOT | Offset voltage temperature drift | IP=0TA=-25~+75℃:≤±0.5 | mV/℃ | ||
Tr | Response time | ≤1 | μS | ||
f | Bandwidth(-3dB) | DC~100 | kHz | ||
TA | Working Temperature | -25~+75 | ℃ | ||
TS | Storage Temperature | -45~+85 | ℃ |
Shape and Installation Dimensions
Circuit link diagram
Note:
+ :Positive 12V/15V power supply
G :Power ground
- :Negative 12V/15V power supply
M :Secondary signal output
Installation Precautions
The sensor should be wired correctly, otherwise it may damage the internal components of the sensor
When the sensor is soldered to the circuit board, it needs to be soldered with a low-temperature soldering iron, and the time should not be too long, and secondly, the pins should not be squeezed by a large amount, otherwise the internal connection may be opened.
Dynamic performance (DI/DT and response time) is best when the input current row is fully filled with the primary perforation